The PACK EXPO in Chicago is the most significant event for the packaging and processing industry in North America. It is the meeting point for decision-makers seeking technological answers to global challenges such as skilled labor shortage, complex supply chains, and the demand for maximum OEE.
With MADDOX, we are presenting an intelligent solution in Chicago that digitizes the implicit knowledge of your most experienced specialists and makes it available worldwide at every line. Our assistance system uses machine learning to support operating personnel with precise solution suggestions in real-time during malfunctions. This way, you minimize downtime in your packaging lines, drastically shorten training times, and establish a standard for excellent knowledge management across continents.
